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  october 2008 fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt @2008 fairchild semiconductor corporation fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 1 fgb3236_f085 / fgi3236_f085 ecospark tm 320mj, 360v, n-ch annel ignition igbt features ? industry standard d 2 -pak package ? scis energy = 320mj at t j = 25 o c ? logic level gate drive ? qualified to aec q101 ? rohs compliant applications ? automotive lgnition coil driver circuits ? coil on plug applications package collector to262ab (flange) fdi series g e jedec to-263ab d 2 -pak gate emitter collector
fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 2 package marking and ordering information electrical characteristics t a = 25c unless otherwise noted off state characteristics on state characteristics symbol parameter ratings units bv cer collector to emitter breakdown voltage (i c = 1ma) 360 v bv ecs emitter to collector voltage - reverse battery condition (i c = 10ma) 24 v e scis25 self clamping inductive switching energy (i scis = 14.7a, l = 3.0mhy, t j = 2 5 c ) 3 2 0 m j e scis150 self clamping inductive switching energy (i scis = 10.4a, l = 3.0mhy, t j = 150c) 160 mj i c25 collector current continuous, at v ge = 4.0v, t c = 25c 44 a i c110 collector current continuous, at v ge = 4.0v, t c = 110c 27 a v gem gate to emitter voltage continuous 10 v p d power dissipation total, at t c = 25c 187 w power dissipation derating, for t c > 25 o c1.25w/ o c t j operating junction temperature range -40 to +175 o c t stg storage junction temperature range -40 to +175 o c t l max. lead temp. for soldering (leads at 1.6mm from case for 10s) 300 o c t pkg max. lead temp. for soldering (package body for 10s) 260 o c esd electrostatic discharge voltage at100pf, 1500 ? 4kv device marking device package reel size tape width quantity fgb3236 fgb3236_f085 to263 330mm 24mm 800 units fgi3236 fgi3236_f085 to262 tube na 50 units symbol parameter test conditions min typ max units bv cer collector to emitter breakdown voltage i ce = 2ma, v ge = 0, r ge = 1k ? , see fig. 15 t j = -40 to 150 o c 330 363 390 v bv ces collector to emitter breakdown voltage i ce = 10ma, v ge = 0v, r ge = 0, t j = -40 to 150 o c 350 378 410 v bv ecs emitter to collector breakdown voltage i ce = -75ma, v ge = 0v, t c = 25c 30 - - v bv ges gate to emitter breakdown voltage i ges = 2ma 12 14 - v i ces collector to emitter leakage current v ces = 250v, see fig. 11 t c = 25 o c--25 a t c = 150 o c--1ma i ecs emitter to collector leakage current v ec = 24v, s e e f i g . 1 1 t c = 25 o c --1 ma t c = 150 o c--40 r 1 series gate resistance - 100 - ? r 2 gate to emitter resistance 10k - 30k ? v ce(sat) collector to emitter saturation voltage i ce = 6a, v ge = 4v, t c = 25 o c , see fig. 3 -1.141.4 v v ce(sat) collector to emitter saturation voltage i ce = 10a, v ge = 4.5v, t c = 150 o c, see fig. 4 -1.321.7 v v ce(sat) collector to emitter saturation voltage i ce = 15a, v ge = 4 . 5 v, t c = 150 o c - 1.61 2.05 v i ce(on) collector to emitter on state current v ge = 5v, v ce = 5v 50 - - a device maximum ratings t a = 25c unless otherwise noted
fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 3 electrical characteristics t a = 25c unless otherwise noted dynamic characteristics switching characteristics thermal characteristics symbol parameter test conditions min typ max units q g(on) gate charge i ce = 10a, v ce = 12v, v ge = 5v, see fig.14 -20-nc v ge(th) gate to emitter threshold voltage i ce = 1ma, v ce = v ge, see fig. 10 t c = 25 o c 1.3 1.6 2.2 v t c = 150 o c 0.75 1.1 1.8 v gep gate to emitter plateau voltage v ce = 12v, i ce = 1 0 a - 2 . 6 - v t d(on)r current turn-on delay time-resistive v ce = 14v, r l = 1 ? v ge = 5v, r g = 1k ? t j = 25 o c, see fig.12 -0.654 s t rr current rise time-resistive - 1.7 7 s t d(off)l current turn-off delay time-inductive v ce = 300v, l = 500 hy, v ge = 5v, r g = 1k ? t j = 25 o c, see fig.12 - 5 . 4 1 5 s t fl current fall time-inductive - 1.64 15 s scis self clamped inductive switching t j = 25 o c, l = 3.0mhy, i ce = 14.7a, r g = 1k ?, v ge = 5v, see fig.1&2 - - 320 mj r jc thermal resistance junction to case all packages - - 0.8 o c/w
fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 4 typical performance curves figure 1. self clamped inductive switching current vs. time in clamp 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25 30 35 scis curves valid for v clamp voltages of <410v t j = 150 o c t j = 25 o c t clp , time in clamp ( s ) i scis , inductive switching current (a) r g = 1k ? , v ge = 5v figure 2. 0246810 0 5 10 15 20 25 30 35 scis curves valid for v clamp voltages of <410v t j = 150 o c t j = 25 o c l, inductance ( mhy ) i scis , inductive switching current (a) r g = 1k ? , v ge = 5v self clamped inductive switching current vs. inductance figure 3. -75 -50 -25 0 25 50 75 100 125 150 175 1.00 1.05 1.10 1.15 1.20 1.25 i ce = 6a v ge = 8v v ge = 5v v ge = 4.5v v ge = 4.0v v ge = 3.7v v ce , collector to emitter voltage (v) t j , junction temperture ( o c ) collector to emitte r on-state voltage vs. junction temperature figure 4. -75 -50 -25 0 25 50 75 100 125 150 175 1.20 1.25 1.30 1.35 1.40 1.45 i ce = 10a v ge = 8v v ge = 5v v ge = 4.5v v ge = 4.0v v ge = 3.7v v ce , collector to emitter voltage (v) t j , junction temperture ( o c ) collector to emitte r on-state voltage vs. junction temperature figure 5. 01234 0 10 20 30 40 50 t j = -40 o c v ge = 4.5v v ge = 5.0v v ge = 3.7v v ge = 4.0v v ge = 8.0v v ce , collector to emitter voltage (v) i ce , collector to emitter current (a) collector to emitte r on-state voltage vs. collector current figure 6. collector to emitter on-state voltage vs. collector current 01234 0 10 20 30 40 50 t j = 25 o c v ge = 4.5v v ge = 5.0v v ge = 3.7v v ge = 4.0v v ge = 8.0v v ce , collector to emitter voltage (v) i ce , collector to emitter current (a)
fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 5 figure 7. 01234 0 10 20 30 40 50 t j = 175 o c v ge = 4.5v v ge = 5.0v v ge = 3.7v v ge = 4.0v v ge = 8.0v v ce , collector to emitter voltage (v) i ce , collector to emitter current (a) collector to emitte r on-state voltage vs. collector current figure 8. 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 10 20 30 40 50 t j = -40 o c t j = 25 o c t j = 175 o c pulse duration = 80 s duty cycle = 0.5% max v ce = 5v i ce , collector to emitter current (a) v ge , gate to emitter voltage (v) transfer characteristics figure 9. 25 50 75 100 125 150 175 0 10 20 30 40 50 i ce , dc collector current (a) t c , case temperature ( o c ) v ge = 4.0v dc collector current vs. case temperature figure 10. threshold voltage vs. junction temperature -50 -25 0 25 50 75 100 125 150 175 0.8 1.0 1.2 1.4 1.6 1.8 2.0 v ce = v ge i ce = 1m a v th , threshold voltage (v) t j , junction temperature ( o c ) figure 11. -50 -25 0 25 50 75 100 125 150 175 0.1 1 10 100 1000 10000 50000 v ces = 250v v ces = 300v v ecs = 24v t j , junction temperature ( o c ) leakage current ( a ) leakage current vs. junction temperature figure 12. 25 50 75 100 125 150 175 0 2 4 6 8 10 12 14 resistive t on inductive t off resistive t off switching time ( s ) t j , junction temperature ( o c ) i ce = 6.5a, v ge = 5v, r g = 1k ? switching time vs. junction temperature typical performance curves (continued)
fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 6 figure 13. 0 5 10 15 20 25 0 400 800 1200 1600 2000 f = 1mhz v ge = 0v c res c oes c ies v ds , drain to source voltage ( v ) capacitance (pf) capacitance vs. coll ector to emitter voltage figure 14. 0 1020304050 0 2 4 6 8 10 i ce = 10a, t j = 25 o c v ce = 6v v gs , gate to emitter voltage(v) q g , gate charge(nc) v ce = 12v gate charge figure 15. 10 100 1000 350 360 370 380 t j = 25 o c t j = -40 o c t j = 175 o c i cer = 10ma r g , series gate resistance ( ? ) bv cer , breakdown voltage (v) 6000 break down voltage vs. series gate resistance figure 16. 10 -5 10 -4 10 -3 10 -2 10 -1 1 1e-3 0.01 0.1 1 single pulse d = 0.50 0.20 0.10 0.05 0.02 0.01 normalized thermal impedance, z jc t, rectangular pulse duration(s) duty cycle - descending order 2 notes: duty factor: d = t 1 /t 2 peak t j = p dm x z jc x r jc + t c p dm t 1 t 2 igbt normalized transient thermal impedance, junction to case typical performance curves (continued)
test circuit and waveforms fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 7
fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 8
october 2008 fgb3236_f085 / fgi3236_f085 320m j, 360v, n-channel ignition igbt @2008 fairchild semiconductor corporation fgb3236_f085 / fgi3236_f085 rev. a www.fairchildsemi.com 9
? 2008 fairchild semiconductor corporation www.fairchildsemi.com trademarks the following includes registered and unregistered trademarks and se rvice marks, owned by fairchild semiconductor and/or its gl obal subsidiaries, and is not intended to be an exhaustive list of all such trademarks. auto-spm ? build it now ? coreplus ? corepower ? crossvolt ? ctl? current transfer logic? ecospark ? efficentmax? ezswitch?* ?* ? fairchild ? fairchild semiconductor ? fact quiet series? fact ? fast ? fastvcore ? fetbench ? flashwriter ? * fps ? f-pfs ? frfet ? global power resource sm green fps ? green fps ? e-series ? g max ? gto ? intellimax ? isoplanar ? megabuck? microcoupler ? microfet ? micropak ? millerdrive? motionmax? motion-spm? optologic ? optoplanar ? ? pdp spm? power-spm ? powertrench ? powerxs? programmable active droop ? qfet ? qs ? quiet series ? rapidconfigure ? ? saving our world, 1mw/w/kw at a time? smartmax? smart start ? spm ? stealth? superfet ? supersot ? -3 supersot ? -6 supersot ? -8 supremos? syncfet? sync-lock? ? * the power franchise ? tinyboost ? tinybuck ? tinylogic ? tinyopto ? tinypower ? tinypwm ? tinywire ? trifault detect ? truecurrent ? * serdes ? uhc ? ultra frfet ? unifet ? vcx ? visualmax ? xs? * trademarks of system general corporation, used under license by fairchild semiconductor. disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function, or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. these specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers these products. life support policy fairchild?s products are not authorized for use as critical co mponents in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provi ded in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. anti-counterfeiting policy fairchild semiconductor corporation's anti-counterfeiting policy. fairchild's anti-counterfeiting policy is also stated on our external website, www.fairchildsemi.com, under sales support. counterfeiting of semiconductor parts is a growing problem in t he industry. all manufacturers of semiconductor products are exp eriencing counterfeiting of their parts. customers who inadvertently purchase counter feit parts experience many problems such as loss of brand reputation, substandard p erformance, failed applications, and increased cost of production and manufacturing delays. fairchild is taking strong measures to protect ourselves and our cus tomers from the proliferation of counterfeit parts. fairchild strongly encourages customers to purchase fairchild parts eit her directly from fairchild or from a uthorized fairchild distributors who are listed by country on our web page cited above. products customers buy either from fairchild directly or from authorized fairchi ld distributors are genuine parts, have full traceability, meet fairch ild's quality standards for handling and storage and pr ovide access to fair child's full range of up-to-date technical and product information. fairchild and our authorized distributors will stand behind all warranties and will appropr iately address any warranty issues t hat may arise. fairchild will not provide any warranty coverage or other assistance for parts bought from u nauthorized sources. fairchild is committed to combat this glo bal problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. product status definitions definition of terms datasheet identification product status definition advance information formative / in design datasheet contains the design s pecifications for product developmen t. specifications may change in any manner without notice. preliminary first production datasheet contains preliminary data; supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice to improve design. no identification needed full production datasheet contains final specific ations. fairchild semiconductor rese rves the right to make changes at any time without notice to improve the design. obsolete not in production datasheet contains specificati ons on a product that is disconti nued by fairchild semiconductor. the datasheet is for reference information only. rev. i40


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